Effect of Coating Self-Assembled Monolayer on Room-Temperature Bonding of Cu Micro-Interconnects
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<jats:p> The effect of coating the surface of a Cu microbump with a 1-hexanethiol self-assembled monolayer (SAM) on room-temperature solid-phase bonding was investigated. The microbump was cone-shaped while the counterelectrode was planar. Room-temperature bonding was performed by applying ultrasonic vibration. Chemical analysis showed that the SAM coating suppressed the surface oxidation of Cu. However, it was shown that the SAM coating also reduced the mechanical strength of the bonded interface, whereas little effect was observed in the electrical resistance of bump interconnects. </jats:p>
収録刊行物
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- Japanese journal of applied physics : JJAP
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Japanese journal of applied physics : JJAP 52 (6), 068004-, 2013-06
Tokyo : The Japan Society of Applied Physics
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詳細情報 詳細情報について
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- CRID
- 1520853831952786048
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- NII論文ID
- 40019678444
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- NII書誌ID
- AA12295836
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- ISSN
- 00214922
- 13474065
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- NDL書誌ID
- 024644820
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- 本文言語コード
- en
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- NDL 雑誌分類
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- ZM35(科学技術--物理学)
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- データソース種別
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- NDL
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