In situ formation of HfN/HfSiON gate stacks with 0.5nm equivalent oxide thickness utilizing electron cyclotron resonance plasma sputtering on three-dimensional Si structures

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  • In situ formation of HfN HfSiON gate stacks with 0 5nm equivalent oxide thickness utilizing electron cyclotron resonance plasma sputtering on three dimensional Si structures
  • Special issue: Solid state devices and materials
  • Special issue Solid state devices and materials

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