Mechanism and Prevention of Spontaneous Tin Whisker Growth (Overview)
Bibliographic Information
- Other Title
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- Mechanism and Prevention of Spontaneous Tin Whisker Growth Overview
- Special Issue on Lead-Free Soldering in Electronics(3)
- Special Issue on Lead Free Soldering in Electronics 3
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Journal
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- Materials transactions
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Materials transactions 46 (11), 2300-2308, 2005-11
Sendai : The Japan Institute of Metals and Materials ; 2001-
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Details 詳細情報について
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- CRID
- 1521136278457665792
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- NII Article ID
- 10016868620
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- NII Book ID
- AA1151294X
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- ISSN
- 13459678
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- NDL BIB ID
- 7710373
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- Text Lang
- en
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- NDL Source Classification
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- ZP41(科学技術--金属工学・鉱山工学)
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- Data Source
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- NDL
- CiNii Articles