Numerical Simulation of Underfill Encapsulation in Flip-chip Packaging

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  • フリップチップパッケージにおけるアンダーフィル封止成形の数値計算(反応・多相系 移動境界,一般講演)

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Abstract

The objective of this research is to develop a computational fluid dynamics (CFD) solver for simulating underfill flow in flip-chip packaging, especially for designing the most optimum condition of solder joint performance. Two types of processes for applying the underfill encapsulant to the gap between IC chip and substrate are presented. It is found that the proposed analytical models have a considerable potential for predicting the underfill flow.

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