50-nm Metal Line Fabrication by Focused Ion Beam and Oxide Resists : Focused Ion Beam Process :
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- KOSHIDA,Nobuyoshi
- Faculty of Technology, Tokyo University of Agriculture and Technology
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- YOSHIDA,Kazuyoshi
- Faculty of Technology, Tokyo University of Agriculture and Technology
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- WATANUKI,Shinichi
- Faculty of Technology, Tokyo University of Agriculture and Technology
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- KOMURO,Masanori
- Electro technical Laboratory
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- ATODA,Nobufumi
- SORTEC
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説明
Ultrafine patterning of refractory metals has been studied by the use of focused ion beam (FIB) and oxide resists. Thin amorphous films of MoO_3 and WO_3 Were deposited by electron beam evaporation onto Si wafers, and were exposed to a 50 keV Ga+ FIB. Developed resist patterns were directly reduced to Mo and W by heat treatment in H_2 gas atmosphere. The linewidth before and after reduction was measured as a function of the line dose. It is demonstrated that from a bilayer resist MoO_3 /WO_3, a 50 nm refractory metal line can be controllably fabricated without any other complicated Processes. Some information about the electrical properties of the reduced patterns is also presented.
収録刊行物
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- JJAP series
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JJAP series 5 329-332, 1992-04-30
Japanese Journal of Applied Physics
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詳細情報 詳細情報について
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- CRID
- 1541417145237748224
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- NII論文ID
- 110003912890
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- NII書誌ID
- AA11020413
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- 本文言語コード
- en
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- データソース種別
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- NDLデジコレ(旧NII-ELS)
- CiNii Articles