Particle Detection for Patterned Wafers Using Hybrid Optical-Digital Image Processing : Inspection and Testing :

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説明

A particle detection method for patterned wafers has been developed. This method achieves much better sensitivity by using hybrid optical-degital-digital image processing. Optical image processing employs newly developed 45°diagonal illumination combined with spatial frequency filtering, to reveal the presence of particles with minimal loss of light energy. Digital image processing is characterized by a two-chip comparison procedure insensitive to positional mismatching between the two chips, and eliminates residual pattern information which could not be completely eliminated by optical image processing alone. This method is performed so as to detect 0.5μm particles on patterned wafers.

収録刊行物

  • JJAP series

    JJAP series 3 371-376, 1989-12-30

    Japanese Journal of Applied Physics

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