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Electrochemical Actions of Flux for Soldering

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Abstract

In order to confirm the electrochemical actions of flux, which contained H^+ and Cl^- ions, for soldering, the spreading test of a low melting point solder on copper base metal and the corrosion potential measurements of the base metal and solder in the studied flux solution were made. Through the experiments and considerations, a new experimental equation, loga_<Cl^->=-4.65+pH, which defines whether the solder does spread or doesen't, was introduced.

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Details

  • CRID
    1570009752371840512
  • NII Article ID
    110006484505
  • NII Book ID
    AA00867058
  • ISSN
    03874508
  • Text Lang
    en
  • Data Source
    • CiNii Articles

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