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Wettability of tin-plated tape carrier package during thermal and humid aging
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- Hosomi Eiichi
- Semiconductor Device Engineering Laboratory,Toshiba Corporation
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- Takubo Chiaki
- Semiconductor Device Engineering Laboratory,Toshiba Corporation
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- Tazawa Hiroshi
- Semiconductor Device Engineering Laboratory,Toshiba Corporation
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- Hiruta Yoichi
- Semiconductor Device Engineering Laboratory,Toshiba Corporation
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- Sudo Toshio
- Semiconductor Device Engineering Laboratory,Toshiba Corporation
Bibliographic Information
- Other Title
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- SnめっきTCPのハンダ濡れ性に対する高温高湿放置の影響
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Description
TCP(tape carrier package)is suitable for thinner and high-pin- count package.However,wettability degradation of the outer leads is getting the problem.This is caused by the thermal processes after inner lead bonding and storage atmosphere.Wettability of tin- plated TCP to Pb, Sn eutectic solder after thermal and humid aging was measured,and surface analisys was carried out by RBS(Rutherford backscattering spectroscopy)and AES(Auger electron spectroscopy).Wettability degradation of the specimens stored in dry N_2 was less than those in air.In the case that TCPs were stored in the humid conditions,their wettability degraded faster than in the dry conditions,because H_2O in the atmosphere promotes the surface oxidation.
Journal
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- Technical report of IEICE. ICD
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Technical report of IEICE. ICD 93 (394), 53-60, 1993-12-17
The Institute of Electronics, Information and Communication Engineers
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Details 詳細情報について
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- CRID
- 1570291227507502336
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- NII Article ID
- 110003316920
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- NII Book ID
- AN10013276
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- Text Lang
- ja
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- Data Source
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- CiNii Articles