Wettability of tin-plated tape carrier package during thermal and humid aging

  • Hosomi Eiichi
    Semiconductor Device Engineering Laboratory,Toshiba Corporation
  • Takubo Chiaki
    Semiconductor Device Engineering Laboratory,Toshiba Corporation
  • Tazawa Hiroshi
    Semiconductor Device Engineering Laboratory,Toshiba Corporation
  • Hiruta Yoichi
    Semiconductor Device Engineering Laboratory,Toshiba Corporation
  • Sudo Toshio
    Semiconductor Device Engineering Laboratory,Toshiba Corporation

Bibliographic Information

Other Title
  • SnめっきTCPのハンダ濡れ性に対する高温高湿放置の影響

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Description

TCP(tape carrier package)is suitable for thinner and high-pin- count package.However,wettability degradation of the outer leads is getting the problem.This is caused by the thermal processes after inner lead bonding and storage atmosphere.Wettability of tin- plated TCP to Pb, Sn eutectic solder after thermal and humid aging was measured,and surface analisys was carried out by RBS(Rutherford backscattering spectroscopy)and AES(Auger electron spectroscopy).Wettability degradation of the specimens stored in dry N_2 was less than those in air.In the case that TCPs were stored in the humid conditions,their wettability degraded faster than in the dry conditions,because H_2O in the atmosphere promotes the surface oxidation.

Journal

  • Technical report of IEICE. ICD

    Technical report of IEICE. ICD 93 (394), 53-60, 1993-12-17

    The Institute of Electronics, Information and Communication Engineers

Details 詳細情報について

  • CRID
    1570291227507502336
  • NII Article ID
    110003316920
  • NII Book ID
    AN10013276
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

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