FBGA/CSP flexible assembly lines with whole-cavity molding method

Bibliographic Information

Other Title
  • 一括封入技術を用いたFBGA/CSPフレキシブルラインの構築

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Description

The introduction of whole-cavity molding and package saw singlation technologies to FBGA/CSP's assembly lines has been realized newly flexible assembly lines with superior productivity. In molding used transfer method, it is possible to encapsulate extent about 10,000mm^2 in area. The package assembled by this flexible line has high reliability for moisture sensitivity level.

Journal

  • Technical report of IEICE. ICD

    Technical report of IEICE. ICD 98 (459), 59-65, 1998-12-11

    The Institute of Electronics, Information and Communication Engineers

Keywords

Details 詳細情報について

  • CRID
    1570291227507759104
  • NII Article ID
    110003317038
  • NII Book ID
    AN10013276
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

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