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LCP film for high frequency printed circuit board It's application and characterization
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- Sato Toshiaki
- Kuraray Co., Ltd New Business Development division
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- Sunamoto Tatsuya
- Kuraray Co., Ltd New Business Development division
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- Tanaka Yoshinobu
- Kuraray Co., Ltd New Business Development division
Bibliographic Information
- Other Title
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- 液晶ポリマーフィルムの高周波実装回路基板への展開と特性
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Description
Liquid crystal polymer is known as the electrical substrate which has the superior heat-resistance and humidity-resistance character. Thanks to it's thermotropic character, it can be combined to various metals without adhesive resin. We control the molecular ordered LCP thermal behavior and the molecular ordered heat-resistancy, so that can make the all-LCP multi-layered printed wiring board which show the excellent high frequency characters (low dielectric constant, low dielectric dissipation in GHz region).
Journal
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- Technical report of IEICE. DSP
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Technical report of IEICE. DSP 99 (486), 23-30, 1999-12-03
The Institute of Electronics, Information and Communication Engineers
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Details 詳細情報について
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- CRID
- 1570572702454114560
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- NII Article ID
- 110003280703
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- NII Book ID
- AN10060786
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- ISSN
- 09135685
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- Text Lang
- ja
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- Data Source
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- CiNii Articles