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Fine Pitch CSP Technology Using Au Ball Bumps as External Terminals
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- NAKAJYO Shinsuke
- Advanced Packaging Tech. R&D Dept. LSI Packaging Div., Fujitsu Ltd.
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- ONODERA Masanori
- Advanced Packaging Tech. R&D Dept. LSI Packaging Div., Fujitsu Ltd.
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- IKUMO Masamitsu
- Advanced Packaging Tech. R&D Dept. LSI Packaging Div., Fujitsu Ltd.
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- KAWAHARA Toshimi
- Advanced Packaging Tech. R&D Dept. LSI Packaging Div., Fujitsu Ltd.
Search this article
Journal
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- Extended abstracts of the ... Conference on Solid State Devices and Materials
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Extended abstracts of the ... Conference on Solid State Devices and Materials 2000 426-427, 2000-08-28
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Details 詳細情報について
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- CRID
- 1570854175236509184
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- NII Article ID
- 10017198425
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- NII Book ID
- AA10777858
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- Text Lang
- en
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- Data Source
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- CiNii Articles