P-3 Bonded Multi-layer Materials : The Materials of the Future(Poster Session,SIMAP'88 Proceedings of International Symposium on Strategy of Innovation in Materials Processing-New Challenge for the 21st Century-)

Details 詳細情報について

• CRID

  1570854177618371712

• NII Article ID

  120004845297

• NII Book ID

  AA00867058

• ISSN

  03874508

• Web Site

  http://hdl.handle.net/11094/11109

• Text Lang

  en

• Data Source

  • CiNii Articles