Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design
Bibliographic Information
- Published
- 2005
Journal
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- Electronic Components and Technology, 2005. Proc. ECTC'05, May-June
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Electronic Components and Technology, 2005. Proc. ECTC'05, May-June 727-731, 2005
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Details 詳細情報について
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- CRID
- 1571135651033337472
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- NII Article ID
- 10026817636
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- Data Source
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- CiNii Articles