A Study on IC Deterioration Detection Using the IC Package Generated Heat

Bibliographic Information

Other Title
  • ICパッケージの発熱によるICの劣化検出の検討

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Description

Previous papers by the author have proven that thermography could be successfully used in the detection of fault ICs. This paper shows that thermography can also be effectively used as a tool to detect IC deterioration.The results obtained from the tests performed on the control board monitor PCB of the East JR Co. Ltd Shinkansen are shown.The results obtained showed that about 30% of the chips tested have deteriorated. Moreover,this fact was verified by heating the ICs and measuring the IC temperatures on the PCBs.Furthermore,the high temperature exhibited by the ICs confirmed their deterioration.

Journal

  • Technical report of IEICE. FTS

    Technical report of IEICE. FTS 93 (372), 9-14, 1993-12-10

    The Institute of Electronics, Information and Communication Engineers

Keywords

Details 詳細情報について

  • CRID
    1571698602306579072
  • NII Article ID
    110003194048
  • NII Book ID
    AN10012998
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

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