Alignment-Free Optical Modules Using Solder-Bump-Bonding Technique for Free-Space Optical Interconnections

26 References
  • MIYAZAKI Daisuke
    Deptartment of Physical Electronics and Informatics, Graduate School of Engineering, Osaka City University
  • OHNO Yuji
    Deptartment of Physical Electronics and Informatics, Graduate School of Engineering, Osaka City University
  • MATSUSHITA Kenji
    Deptartment of Physical Electronics and Informatics, Graduate School of Engineering, Osaka City University

Search this article

Journal

References(26)*help

See more

Keywords

Details 詳細情報について

  • CRID
    1571980075516449280
  • NII Article ID
    10021106654
  • NII Book ID
    AA11029291
  • ISSN
    13406000
  • Text Lang
    en
  • Data Source
    • CiNii Articles

Report a problem

Back to top