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New power module structure with low thermal impedance and high reliability for SiC devices
Journal
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- PCIM Europe 2011
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PCIM Europe 2011 229-234, 2011
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Details 詳細情報について
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- CRID
- 1572261549915195008
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- NII Article ID
- 10029800344
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- Data Source
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- CiNii Articles
