Development of PPF(Pre-Plated-Frame)Package Process
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- Kimura Tomoshi
- Integrated Circuits Group,Sharp
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- Yamaji Yasuhisa
- Integrated Circuits Group,Sharp
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- Miyata Koji
- Integrated Circuits Group,Sharp
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- Aoki Kazumasa
- Integrated Circuits Group,Sharp
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- Narai Atsuya
- Integrated Circuits Group,Sharp
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- Ishio Toshiya
- Integrated Circuits Group,Sharp
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- Fujita Kazuya
- Integrated Circuits Group,Sharp
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- Kada Morihiro
- Integrated Circuits Group,Sharp
Bibliographic Information
- Other Title
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- PPF (Pre-Plated-Frame)パッケージプロセスの開発
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Description
In plastic package assembly process,solder plating for outer- lead has been made by subcontractors,at the end of assembly process.But this has prevented the TAT(turnaround time)from being reduced and the process from being converted to an inline arrangement.A solder PPF(Pre-Plated-Frame)package process including highspeed plating and lower-temperature assembly process has been developed to resolve these problems.In addition, foundation plating specification have been rationalized to remove the solder PPF specific problem of solder deformation during resin molding,thereby offering productivity and reliability equivalent or even superior to the conventional process.
Journal
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- Technical report of IEICE. ICD
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Technical report of IEICE. ICD 94 17-24, 1994
The Institute of Electronics, Information and Communication Engineers
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Details 詳細情報について
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- CRID
- 1572261552344595072
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- NII Article ID
- 110003317378
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- NII Book ID
- AN00245490
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- Text Lang
- ja
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- Data Source
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- CiNii Articles
