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Joining of Silicon Nitride Using Amorphous Cu-Ti Filler Metal(Materials, Metallurgy & Weldability)

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Abstract

Joining of Si_3N_4 to Si_3N_4 was conducted using amorphous Cu_<66>Ti_<34>, Cu_<50>Ti_<50> and Cu_<43>Ti_<57> amorphous filler metals which were produced by liquid quenching, where pressureless sintered Si_3N_4 was used. The fracture shear testing was carried out at room temperature. The joining strength of Si_3N_4 using Cu_<66>Ti_<34> filler is higher than that of Si_3N_4 using other Cu-Ti fillers at any brazing temperature except for brazing temperature of 1273K. Thus, the joining strength of Cu_<66>Ti_<34> filler shows the maximum value of 313.8MPa at brazing temperature of 1323K. The Si_3N_4 joint using Cu_<50>Ti_<50> filler exhibits the gradual decrease in the elevated temperature strength from 199.1MPa at 373K to 105.9MPa at 973K. During brazing Ti in molten Cu_<50>Ti_<50> filler reacts with Si_3N_4 and forms TiN, Ti_5Si_3 and Cu-Si phase at the joining layer. The activation energy for growth of TiN at the joining interface is 206.3kJ/mol, and the growth of TIN is dominated by the diffusion of N in TiN.

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Details

  • CRID
    1572824502138743936
  • NII Article ID
    110006486717
  • NII Book ID
    AA00867058
  • ISSN
    03874508
  • Text Lang
    en
  • Data Source
    • CiNii Articles

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