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Ball Semiconductor Technology
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- TAKEDA Nobuo
- Ball Semiconductor Inc.
Bibliographic Information
- Other Title
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- ボール半導体技術
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Description
This paper discribcs five key enabling technologics of the integrated circuits on the sphere such as the single cristallization technology, the no-contact processing technology to privent damages on the surface, the spherica1 lithography technology, the three dimensional VLSI design technology and the clustering technology for mounting balls. And the electrical characteristics of a MOS transistor is shown here as the first active device on a 1mm Silicon sphere.
Journal
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- IEICE technical report. Electron devices
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IEICE technical report. Electron devices 98 (629), 49-55, 1999-03-05
The Institute of Electronics, Information and Communication Engineers
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Keywords
Details 詳細情報について
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- CRID
- 1573105977193923072
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- NII Article ID
- 110003200730
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- NII Book ID
- AN10012954
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- Text Lang
- ja
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- Data Source
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- CiNii Articles