Ball Semiconductor Technology

Bibliographic Information

Other Title
  • ボール半導体技術

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Description

This paper discribcs five key enabling technologics of the integrated circuits on the sphere such as the single cristallization technology, the no-contact processing technology to privent damages on the surface, the spherica1 lithography technology, the three dimensional VLSI design technology and the clustering technology for mounting balls. And the electrical characteristics of a MOS transistor is shown here as the first active device on a 1mm Silicon sphere.

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Details 詳細情報について

  • CRID
    1573105977193923072
  • NII Article ID
    110003200730
  • NII Book ID
    AN10012954
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

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