銅-タングステン焼結合金と無酸素銅との摩擦圧接継手の強度に及ぼすタングステン含有量の影響
書誌事項
- タイトル別名
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- Effect of Tungsten Content on Bond Strength of Friction Welded Joint of Copper-Tungsten Sintered Alloy to Oxygen Free Copper : Effect of Tungsten Content on Friction Welding of Copper-Tungsten Sintered Alloy to Oxygen Free Copper (Report 2)
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説明
Copper-tungsten sintered alloys (Cu-W) containing 70,80,90 and 100 (pure tungsten) mass%W have been friction-welded to oxygen free copper (OFC), in order to investigate the effect of the W content on bond strength. The tensile strength of joints obtained decreased with the increase in W content. In the joints of Cu-90%W to OFC, a layer which consisted of W grains elongated in a direction parallel to the weld interface was observed in the Cu-W adjacent to the weld interface. A similar layer, including many microcracks, was also observed in the joint of pure W to OFC. Since the layer consisting of elongated grains was also observed on the faying surface, the formation of this layer was attributed to plastic deformation introduced by machining (turning, grinding) of the faying surface. The joint with this layer was fractured in the Cu-W or pure W adjacent to the weld interface as well as the weld interface. However, when this layer was removed by polishing on metallographic paper, joint was not fractured in the Cu-W or pure W. These results suggest that the layer was embrittled. In contrast to this, for W content less than 80%W, the layer with elongated grains was not observed at weld, and the joint was fractured at weld interface and/or in the OFC. In this case, since a lot of W particles were found to be picked up in the OFC adjacent to the weld interface, the surface layer with elongated grains was presumably removed during friction welding.
収録刊行物
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- 溶接学会論文集
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溶接学会論文集 7 (4), 444-449, 1989
社団法人溶接学会
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詳細情報 詳細情報について
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- CRID
- 1573950402137465600
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- NII論文ID
- 110003422997
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- NII書誌ID
- AN1005067X
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- ISSN
- 02884771
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- 本文言語コード
- ja
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- データソース種別
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