The State-of-Art and Problems of The Recent Packages : CSP, BGA, etc

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Bibliographic Information

Other Title
  • CSP、BGA等最新パッケージ技術の現状と問題点

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Description

In this session, we discuss the technical state-of-art of the recent packages such as CSP(Chip Scale Package) and BGA(Ball Grid Array) and related problems. These packages are currently applied to many kinds of small size handy phones and IC and PC cards which require high density package technologies. In order to achieve the higher pin counts and thinner thickness needed in these packages. there are some technical problems which we should solve. The panelists who are working on the front end of this technologies, will hopefully propose some breakthrough and discuss their successful applications.

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Details 詳細情報について

  • CRID
    1574231877096681088
  • NII Article ID
    110003199058
  • NII Book ID
    AN10012932
  • Text Lang
    ja
  • Data Source
    • CiNii Articles

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