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An Inductively Coupled Wireless Bus for Chiplet-Based Systems
Description
A wireless bus for inter-chiplet communication is presented. Utilizing horizontal inductive coupling of on-chip coils, wireless connection between chiplets are established. A test chip prototyped in 0.18 $\mu m$ CMOS confirms 2.0 Gb/s bus communication between horizontally arranged coils with BER of less than $10^{-12}$.
Journal
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- 2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC)
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2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC) 9-10, 2020-01-01
IEEE