Effect of coupling agent on dielectric breakdown of glass-polyamideimide composite films prepared by sol-gel process
説明
We describe the distribution of glass particles in glass-polyamideimide (PAI) composite films prepared by the sol-gel process and discuss effects of the silane coupling agent and the interface between glass and PAI on their dielectric breakdown and their thermal degradation.
収録刊行物
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- Proceedings of 1995 International Symposium on Electrical Insulating Materials
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Proceedings of 1995 International Symposium on Electrical Insulating Materials 343-346, 2002-11-19
Inst. Electr. Eng. Japan