Propagation Behaviour of Intergranular Stress-Corrosion Cracking of Cu-9at.%Al Bicrystals Shaped to the Tapered Double Cantilever Beam Specimen
説明
Intergranular stress-corrosion cracking (SCC) in a αCu-Al alloy has been investigated on bicrystals shaped to a tapered double cantilever beam (TDCB) specimen. The SCC property was estimated by the relationship between crack growth rate da/dt and energy release rate g- The bicrystal specimens of two kinds (Σ5 and random boundaries) were prepared. During the SCC tests, the applied load continued to decrease and was saturated subsequently. Surface observation after the SCC tests revealed that the crack propagated along the Grain Boundary. In both specimens, the da/dt-g curves calculated from the load relaxation could be divided into Regimes I and II at low and high g-values, respectively. The crack growth rates increased with the increasing g-value in Regime I and was independent of the g-value in Regime II. Both of the threshold g-value in Regime I and the crack growth rate in Regime II, which can characterize the SCC properties, were certainly different between the specimens. It is likely that such differences are attributed to the GB structure and the geometry of operative slip systems.
収録刊行物
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- Materials Science Forum
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Materials Science Forum 294-296 169-172, 1998-11-01
Trans Tech Publications, Ltd.
