Microstructural change and hardness of lead free solder alloys
説明
Two types of Pb free solder, Sn-Ag eutectic alloy and Sn-Zn eutectic alloy, as potential replacements for Sn-Pb eutectic solder and Sn-Pb eutectic alloy were found to age-soften during storage at room temperature (25 C, 298 K, 77 F) and high temperature (100 C, 373 K 212 F). The hardness of another type of Pb free solder, Sn-Bi eutectic alloy, did not change during storage at room and high temperature. However, the microstructure of Sn-Bi eutectic alloy coarsened unusually during storage at room and high temperature.
収録刊行物
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- Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing
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Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing 616-619, 1999-01-01
IEEE
