Low Temperature Deposition of Transparent Ultra Water-Repellent Thin Films by Microwave Plasma Enhanced Chemical Vapor Deposition

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<jats:title>ABSTRACT</jats:title><jats:p>One of the most common methods for obtaining water repellent surfaces is spreading fluoropolymer or fluoroalkylsilane onto substrates. However, this method is not applicable to low heat-resistant substrates such as plastics, since after spreading, the method requires a heating process which is generally conducted at a temperature of about 600K. The objective of this study is the preparation of ultra water-repellent and optically transparent thin films at low temperatures below 373K. The films were deposited by means of microwave plasma enhanced plasma chemical vapor deposition (MPECVD) using organosilane, that is, trimethylmethoxysilane (TMMOS) as a source with adding Ar, CO<jats:sub>2</jats:sub>, N<jats:sub>2</jats:sub>, O<jats:sub>2</jats:sub> or air as an excitation gas. Under optimized preparation conditions, films with water contact angles more than 150 degrees and optical transparencies more than 90% were successfully fabricated.</jats:p>

Journal

  • MRS Proceedings

    MRS Proceedings 711 2001-01-01

    Springer Science and Business Media LLC

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