Formation of slip dislocations during Czochralski growth of copper and its dilute alloys crystals

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Single crystals of pure (99.996%) Cu and its dilute alloys containing 0.05–0.5 at % Ni, 0.05–0.5 at % Al and 0.01–0.2 at % Au were grown with [111] orientation by the Czoehralski method, and the dislocation distribution patterns on the transverse (111) cross sections were examined by an etching technique. In Cu crystals, a slip pattern composed of linear arrays of dislocation etch pits was frequently revealed. The formation of the slip patterns was more pronounced in the alloy crystals with 0.05–0.1 at % Ni than in the Cu crystal. On the contrary, the slip pattern was scarcely observed in the alloy crystals with 0.05–0.5 at % Al and 0.03–0.05 at % Au. These findings indicate that the lattice hardening mechanism is not sufficient to explain the formation of the slip patterns in copper dilute alloy crystals.

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