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High-temperature electronic devices enabled by hBN-encapsulated graphene
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Description
<jats:p>Numerous applications call for electronics capable of operation at high temperatures where conventional Si-based electrical devices fail. In this work, we show that graphene-based devices are capable of performing in an extended temperature range up to 500 °C without noticeable thermally induced degradation when encapsulated by hexagonal boron nitride (hBN). The performance of these devices near the neutrality point is dominated by thermal excitations at elevated temperatures. Non-linearity pronounced in electric field-mediated resistance of the aligned graphene/hBN allowed us to realize heterodyne signal mixing at temperatures comparable to that of the Venus atmosphere (∼460 °C).</jats:p>
Journal
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- Applied Physics Letters
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Applied Physics Letters 114 2019-03-25
AIP Publishing
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Keywords
Details 詳細情報について
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- CRID
- 1870865117969947904
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- ISSN
- 10773118
- 00036951
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- Data Source
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- OpenAIRE