Modeling on hydrodynamic effects of pad surface roughness in CMP process
説明
A model of pad surface roughness is proposed, in order to estimate the hydrodynamic pressure of slurry in the CMP process. Measurements of the friction coefficient between wafers and pads show good agreement with the model at high viscosity and high speed conditions, wherein the hydrodynamic pressure is dominant. This model should be useful for understanding of the contact mechanism between the wafers, the pads and the abrasives in CMP processes.
収録刊行物
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- Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247)
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Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) 89-91, 2003-01-20
IEEE