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Micro tensile-test system fabricated on a single crystal silicon chip
Description
We have developed a uniaxial tensile test structure on a single crystal silicon chip. This enables tensile testing of MEMS materials, such as bulk silicon and thin film materials, to be carried out directly on the chip without manipulating a small specimen during the test procedure as in previous work. The structure was designed so that uniaxial force is applied to the specimen when a lever structure on the same chip is loaded perpendicular to the surface. The chip was fabricated on a (100) silicon wafer using chemical anisotropic etching.
Journal
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- Proceedings of Ninth International Workshop on Micro Electromechanical Systems
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Proceedings of Ninth International Workshop on Micro Electromechanical Systems 360-364, 2002-12-23
IEEE