Semiconductor Film Bonding Technology and Application in Two-axis Hall Sensor Fabrication
この論文をさがす
説明
<jats:title>ABSTRACT</jats:title><jats:p>We study basic problems of the semiconductor film bonding technology. We propose a new releasing method for a large number of semiconductor films using the film photoresist to protect the semiconductor films. We investigated the basic process conditions. We successfully released a large number of the GaAs film and bonded them on the Si, LiNbO<jats:sub>3</jats:sub> substrates and metal Au surface. We estimated the ctystallinity of semiconductor films by X-ray diffraction and Raman spectral. The results clarified that these process were effective. As an application of the semiconductor film bonding technology, we fabricated a two-axis Hall sensor with planar structure. The two-axis hall sensor can measure axial and radial magnetic filed components (<jats:italic>Bx and Bz</jats:italic>) with a sensitivity of about 9.2 Ω/G for <jats:italic>Bz</jats:italic> and 4.5 Ω/G for <jats:italic>Bx</jats:italic> respectively.</jats:p>
収録刊行物
-
- MRS Proceedings
-
MRS Proceedings 1079 2008-01-01
Springer Science and Business Media LLC