Joining Joining of silicon nitride with Al-Cu alloys

M. Kubo, M. Naka, Ikuo Okamoto

doi:10.1007/bf01132040

The sessiie drop technique was used to evaluate the equilibrium contact angle and work of adhesion of molten Al-Cu alloys on Si3N4 at 1373 K under vacuum. The wettability of Al-Cu alloys on Si3N4 is improved by an addition of copper content up to 20 at%. The joining of Si3N4 to Si3Ni4 was also conducted using Al-Cu filler metal at a brazing condition of 1373 K for 3.8 ksec. The dependence of strength of the Si3N4 joint against the copper content in the filler corresponds to the copper content dependence of work of adhesion for molten Al-Cu alloy on Si3N4. The superior wettability and mechanical property of filler provide the superior strength of Si3N4 brazed with the filler. In particular, the Si3N4 joint brazed with Al-1.7 at% Cu filler exhibits the maximum fracture shear strength of 188.3 MPa at room temperature. This superior strength of Si3N4 brazed with Al-1.7 at% Cu filler is maintained at elevated temperatures up to 850 K.

Joining Joining of silicon nitride with Al-Cu alloys

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