Improved heat and solvent resistance of a pressure‐sensitive adhesive thermally processable by isocyanate dimer dissociation
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説明
<jats:title>ABSTRACT</jats:title><jats:p>Methods that do not involve use of an organic solvent are being considered for manufacturing environmental‐friendly pressure‐sensitive adhesive tapes. Among these methods, the hot‐melt method exhibits high productivity but is somewhat limited in terms of performance. Hot‐melt‐fabricated pressure‐sensitive adhesives require heating fluidization and cooling solidification, and it is extremely difficult to improve their heat resistance. We examine thermally processable pressure‐sensitive adhesives with a completely new structure, fabricated based on the thermal dissociation of the isocyanate dimer. This enables thermal processing of materials softened by thermal dissociation. Fabrication of crosslinkable pressure‐sensitive adhesive becomes possible through a reaction of isocyanate caused by dissociation of its dimer. It is found that improving thermal and solvent resistances, which are disadvantages associated with conventional hot‐melt pressure‐sensitive adhesives, is potentially possible with the pressure‐sensitive adhesive reported here. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. <jats:bold>2015</jats:bold>, <jats:italic>132</jats:italic>, 41444.</jats:p>
収録刊行物
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- Journal of Applied Polymer Science
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Journal of Applied Polymer Science 132 2014-09-30
Wiley