Cu-Cu direct bonding by introducing Au intermediate layer
説明
Cu-Cu direct bonding under help of direct immersion gold (DIG) for multi-die fan-out wafer level package was demonstrated. Cu-Cu direct bonding is a critical technology for high-frequency applications. To solve challenges of conventional methods, the DIG was used. As a result, a cohesion failure was obtained in shear test.
収録刊行物
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- 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 70-70, 2017-05-01
IEEE
