- 【Updated on May 12, 2025】 Integration of CiNii Dissertations and CiNii Books into CiNii Research
- Trial version of CiNii Research Knowledge Graph Search feature is available on CiNii Labs
- Suspension and deletion of data provided by Nikkei BP
- Regarding the recording of “Research Data” and “Evidence Data”
Cu-Cu direct bonding by introducing Au intermediate layer
Description
Cu-Cu direct bonding under help of direct immersion gold (DIG) for multi-die fan-out wafer level package was demonstrated. Cu-Cu direct bonding is a critical technology for high-frequency applications. To solve challenges of conventional methods, the DIG was used. As a result, a cohesion failure was obtained in shear test.
Journal
-
- 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
-
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) 70-70, 2017-05-01
IEEE
