Dynamic observation of dislocation movement across twin boundaries in the lamellar structure of TiAl intermetallic compound
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説明
Abstract Mechanisms of enhancement of plastic deformation in TiAl responsible for ductility improvement of this material, have been studied by high-voltage electron microscopy (HVEM) and atom probe field ion microscopy (AP-FIM). During cross-twinning, a dislocation interaction occurs at twin boundaries. Dislocation networks and fine Ti 3 Al particles on the pre-existing twin boundaries promote the formation and movement of twinning partial dislocations, contributing to an improvement of ductility.
収録刊行物
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- Ultramicroscopy
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Ultramicroscopy 39 86-91, 1991-11-01
Elsevier BV