Effect of Molecular Structure of Scavengers on Copper Diffusion Deterrence in Low k Film
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説明
<jats:title>ABSTRACT</jats:title><jats:p>Low k material with high deterrence ability of copper diffusion has been proposed to reduce the effective electrical resistance of copper wirings. Providing organic low k material with deterrence ability was attempted by adding a chemical agent that chemically combines with copper. The insulation lifetime of the low k film with benzotriazole (BTA) as the copper scavenger was about two orders of magnitude higher than that of BTA-free low k film, at the practical electric field strength of 0.1 MV/cm. The copper diffusion deterrence ability was clearly dependent on the ability of the copper scavenger.</jats:p>
収録刊行物
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- MRS Proceedings
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MRS Proceedings 949 2006-01-01
Springer Science and Business Media LLC