An inductive-coupling bus with collision detection scheme using magnetic field variation for 3-D network-on-chips
説明
A wireless vertical bus with collision detection scheme for 3-D network-on-chips (NoC) is presented. Utilizing inductive-coupling between coils, wireless connection between all stacked chips is established. Data collision is detected by sensing magnetic field variation. A test chip is fabricated in 65 nm SOI CMOS technology. A data rate of 0.8 Gb/s with a BER < 10−12 is achieved. The energy efficiency is better than 1.4 pJ/b. A collision detection circuit is implemented and its operation is confirmed.
収録刊行物
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- 2016 IEEE Asian Solid-State Circuits Conference (A-SSCC)
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2016 IEEE Asian Solid-State Circuits Conference (A-SSCC) 41-44, 2016-11-01
IEEE