説明
<jats:p>Copper/aluminum/stainless steel (Cu/Al/STS) clad materials were made by rolling and heat treatment process. These specimens were evaluated the formability and bonding strength of Cu/Al/STS clad materials. Thin disc specimens for TEM observation were prepared from the interfaces of Cu/Al and Al/STS by using the Focused Ion Beam (FIB) utility. Brittle oxide film formed on copper surface during heat treatment at 673K~773K. Diffusion bonding was observed at the interface of Cu/Al. Reacted region was formed in the interface of Al/STS with width about 10nm, while in the case of Cu/Al was formed about 1,600nm width. It was also observed nanosized crevice in reacted region of Al/STS interfaces.</jats:p>
収録刊行物
-
- Key Engineering Materials
-
Key Engineering Materials 345-346 1497-1500, 2007-08-15
Trans Tech Publications Ltd.