Non halogen/antimony flame retardant system for high end IC package

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All industries have started to conduct research in environmentally safe materials. In the electronics industry also environmental issue is one of the most important concerns being addressed with rapid technical improvement. Flame retardant agents like halogen and antimony oxide are used in plastic molding compounds to provide flame retardant characteristics to all plastic encapsulated packages. However these materials have concerns as they are considered environmental hazards. This paper deals with the study of a new environmentally safe flame retardant system for plastic encapsulants. We studied the application of a new non halogen and non antimony oxide flame retardant system for the molding compound of Ball Grid Arrays (BGA) as the next generation conventional standard package.

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