Self-Assembly with Metal Microbump-to-Microbump Bonding for Advanced Chip-to-Wafer 3D Integration

収録刊行物

• Extended Abstracts of the 2010 International Conference on Solid State Devices and Materials

  Extended Abstracts of the 2010 International Conference on Solid State Devices and Materials 2010-09-24

  The Japan Society of Applied Physics