Acoustic Microscopy for Micro Electrical Interconnections
説明
<jats:p>This paper describes on acoustic microscopy for evaluation of micro electrical interconnection. We visualize the joint interface between silicon chip and the printed circuit board by means of acoustic microscopy, and show the limitation in the evaluation of the electrical interconnection by acoustical manner. Also we design the optimum dry-coupling ultrasonic transmission system, and visualize the joint interface under a dry condition.</jats:p>
収録刊行物
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- Advances in Electronic Packaging, Parts A, B, and C
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Advances in Electronic Packaging, Parts A, B, and C 1689-1693, 2005-01-01
ASMEDC