Erratum: Development of wafer-level-packaging technology for simultaneous sealing of accelerometer and gyroscope under different pressures (2016 <i>J. Micromech. Microeng</i>. <b>26</b> 105007)

Details 詳細情報について

• CRID

  1872835442871519488

• DOI

  10.1088/1361-6439/aa681f

• ISSN

  13616439

  09601317

• Data Source

  • OpenAIRE