Random pattern testability of the open defect detection method using application of time-variable electric field
説明
In this paper, random pattern testability of the open defect defection method is discussed. In the test method, time-variable electric field is applied from the outside of ICs so as to vary the voltage at floating nodes caused by a defect. To detect opens the excessive supply current caused by the applied electric field is measured. The test pattern requirements for detecting opens are shown. The fault coverage for open defects is calculated for benchmark circuits. The experimental results shows random pattern can be effectively utilized for the test method even if it cannot attain high fault coverage for stuck-at-faults.
収録刊行物
-
- Proceedings First IEEE International Workshop on Electronic Design, Test and Applications '2002
-
Proceedings First IEEE International Workshop on Electronic Design, Test and Applications '2002 387-391, 2003-06-25
IEEE Comput. Soc