Highly (111) Oriented Al Thin Films by Ion-Plating Method Using Discharge Plasma
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説明
<jats:title>ABSTRACT</jats:title><jats:p>Application to aluminum deposition using ion-plating method is described. This method has several superior features for generating highly (111) orientation. The origin of this orientation and surface roughness are discussed in connection with a kinetic energy of the ions. The film properties thus made were compared with those of a conventional sputtered film. The higher (111) oriented film showed high resistance against hillock formation even after annealing at high temperatures. An effect of a plasma cleaning of substrate surface was confirmed to be quite helpful for promotion of (111) preferred orientation.</jats:p>
収録刊行物
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- MRS Proceedings
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MRS Proceedings 714 2001-01-01
Springer Science and Business Media LLC
