Electronic properties of molten Cu‐CuTlTe<sub>2</sub> and Ag‐AgTlTe<sub>2</sub> systems

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<jats:title>Abstract</jats:title><jats:p>Measurements of the electrical conductivity, magnetic susceptibility and thermoelectric power in liquid Cu‐CuTlTe<jats:sub>2</jats:sub> and Ag‐AgTlTe<jats:sub>2</jats:sub> systems have been carried out over wide temperature and composition ranges. These liquid systems exhibit the compound‐forming behavior in the vicinity of stoichiometric compositions, Cu<jats:sub>3</jats:sub>TlTe<jats:sub>2</jats:sub> and Ag<jats:sub>3</jats:sub>TlTe<jats:sub>2</jats:sub>, such as the conductivity minimum, diamagnetic maximum and reverse in the sign of the thermoelectric power. Radial distribution analyses of the stoichiometric compositions, Cu<jats:sub>3</jats:sub>TlTe<jats:sub>2</jats:sub> and Ag<jats:sub>3</jats:sub>TlTe<jats:sub>2</jats:sub>, by X‐ray and neutron diffractions indicate that the bonding nature of Cu‐Te and Ag‐Te in both alloys is rather covalent, differing from the ionic nature of Tl‐Te in liquid Tl<jats:sub>2</jats:sub>Te which is well‐known as a typical compound‐forming liquid.</jats:p>

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