Folded U-shaped microwire technology for ultra-compact 3D MMICs
説明
A novel microwire technology has been developed to fabricate 3-dimensional structures for use in ultracompact GaAs MMICs. By folding metal into a U-shaped wall and burying it in a relatively thick polyimide insulator, vertical microwires can be made with both greatly reduced process complexity and process compatibility with multi-level interconnects. The proposed microwires are suitable for miniature transmission lines, miniature inductors, shielding walls, and multi-function passive elements like baluns and couplers.
収録刊行物
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- 1996 IEEE MTT-S International Microwave Symposium Digest
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1996 IEEE MTT-S International Microwave Symposium Digest 2 1153-1156, 2002-12-23
IEEE