Corrosion control technique in copper metallization using gas dissolved water
説明
Copper wiring corrosion occurs after CMP as well as during CMP. It can be reduced by post-CMP cleaning using gas dissolved water. A leakage current between Cu wiring often increases during storage after CMP, which is induced by corrosion. Gas dissolved water is able to not only remove residual impurities but also control the surface potential of Cu and barrier metal. Therefore treatment in gas dissolved water can prevent increasing leakage current.
収録刊行物
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- Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519)
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Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519) 105-107, 2003-06-25
IEEE