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Self-assembly-based 3D integration technologies
Description
We have proposed and developed massively parallel chip self-assembly technologies using surface tension of liquid for advanced chip-to-wafer 3D integration. Here, we introduce flip-chip self-assembly in batch processing and reconfigured wafer-to-wafer 3D integration as a new chip-to-wafer 3D integration approach using self-assembly.
Journal
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- 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration
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2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration 151-151, 2012-05-01
IEEE