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説明
Three-dimensional measurement of micro-size products is performed by optical methods and/or SPM-technology. However, there are some problems in each method. In this paper, a novel three-dimensional measurement method for a micro size product is proposed by using the Wavelet transform and the electron-beam of SEM. To perform the measurement, the mechanism of producing shadows of the grid on the surface of the object by back scattering electron beam is discussed. The principle of measurement by using this phenomenon of shadows of grid is proposed. In experiment, a bearing ball whose diameter is 500μm is measured by a grating made of a silicon wafer. It can be confirmed that the standard deviation of this measurement is about 400nm.
収録刊行物
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- SPIE Proceedings
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SPIE Proceedings 7432 743207-, 2008-11-17
SPIE
